Tokyo, Japan

Kenichi Akazawa

This inventor holds 12 USPTO granted patents and 2 published patent applications, primarily in Substrate Processing. Top assignee: Ebara Corporation. Active years: 2017-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenichi Akazawa. Retrieved from https://idiyas.com/inventor/kenichi-akazawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 12 

% Patents Active = 100.0

Average Co-Inventor Count = 4.2

ph-index = 3

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 2017-2025

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Areas of Expertise:
Substrate Transporter
Polishing Head
Elastic Membrane
Substrate Processing
Rinsing Bath
Retaining Ring
Substrate Holding Module
Substrate Cleaning
Transfer Method
Wafer Polishing
Processing Apparatus
Substrate Method
12 patents (USPTO):Explore Patents

Title: **The Innovations of Kenichi Akazawa**

Introduction

Kenichi Akazawa is a prominent inventor based in Tokyo, Japan, known for his significant contributions to the field of engineering and technology. With a remarkable portfolio of 12 patents, he showcases a commitment to innovation and advancement in various industrial applications.

Latest Patents

Kenichi Akazawa's recent patents highlight his ingenuity. One of his notable inventions is the **Break-in Processing Apparatus and Break-in Processing Method**. This apparatus is designed to perform a break-in process for an elastic membrane efficiently, ensuring that the utilization rate of a polishing apparatus remains unaffected. It features a stage for placing an elastic membrane assembly, a break-in determination module, a fluid supply unit for providing pressurized fluid, and a controller to manage operations and determine the completion of the break-in process based on the load applied by the membrane.

Another significant invention is the **Substrate Transporter and Substrate Processing Apparatus Including Substrate Transporter**. This automated apparatus is engineered to convey rectangular substrates and includes components such as multiple conveyance rollers, roller shafts, a motor, and a pusher to automate the lifting and separation of substrates during processing.

Career Highlights

Kenichi Akazawa is associated with Ebara Corporation, where he has made substantial contributions to the development of innovative technologies. His expertise and inventions play a crucial role in enhancing the efficiency and effectiveness of industrial processes within the company.

Collaborations

Throughout his career, Akazawa has had the opportunity to collaborate with talented colleagues, including Kenichi Kobayashi and Osamu Nabeya. The synergy among these innovators fosters a creative environment, leading to the development of groundbreaking technologies that advance their field.

Conclusion

Kenichi Akazawa exemplifies the spirit of innovation through his extensive work and patents. His contributions significantly impact the engineering landscape, demonstrating how inventive solutions can drive progress and improve industrial capabilities. As he continues to innovate, his work will undoubtedly inspire future generations of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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