This inventor holds 1 USPTO granted patent. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Keng-Yuan Liao: Innovator in Semiconductor Packaging
Introduction
Keng-Yuan Liao is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs that enhance the performance and reliability of electronic components. His work is characterized by a focus on addressing thermal management challenges in semiconductor devices.
Latest Patents
Keng-Yuan Liao holds a patent for a flip chip semiconductor package. This invention proposes a unique design where a dam structure is formed of an adhesive compound, such as epoxy resin, on a substrate surrounding a chip. The adhesive compound has a larger coefficient of thermal expansion than that of the substrate, generating a greater thermal contraction force to counteract thermal stress during the cooling process in fabrication. This design helps maintain the planarity and structural integrity of both the substrate and the chip. Additionally, the chip is designed to expose a non-active surface to the atmosphere, facilitating heat dissipation. A heat sink can also be added to further improve the heat dissipation efficiency of the semiconductor package.
Career Highlights
Keng-Yuan Liao is associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work at this company has allowed him to contribute to advancements in semiconductor packaging technology, making significant impacts on the efficiency and reliability of electronic devices.
Collaborations
Keng-Yuan Liao has collaborated with notable colleagues, including Han-Ping Pu and Shih-Kuang Chiu. These collaborations have fostered an environment of innovation and have led to the development of cutting-edge technologies in the semiconductor field.
Conclusion
Keng-Yuan Liao's contributions to semiconductor packaging through his innovative designs and patents highlight his role as a key inventor in the industry. His work not only addresses critical challenges in thermal management but also enhances the overall performance of semiconductor devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile