The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2002
Filed:
Oct. 09, 2001
Han-Ping Pu, Taipei, TW;
Shih-Kuang Chiu, Taichung, TW;
Keng-Yuan Liao, Taichung, TW;
Chien-Ping Huang, Hsinchu, TW;
Abstract
A flip chip semiconductor package is proposed, in which a dam structure is formed of an adhesive compound such as epoxy resin on a substrate around a chip. The adhesive compound has a larger coefficient of thermal expansion than that of the substrate, and generates a greater thermal contraction force for counteracting thermal stress of the substrate in a cooling process in fabrication, so as to maintain planarity and structural intactness of the substrate and chip. Moreover, the chip can be made in a manner as to expose a non-active surface thereof to the atmosphere for facilitating dissipation of heat generated by the chip, while a heat sink can be additionally disposed on the chip, so as to further improve heat dissipating efficiency of the semiconductor package.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile