Ken-Hung Kuo

Title: Ken-Hung Kuo: Innovator in Semiconductor Packaging

Introduction

Ken-Hung Kuo is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and patents. His work is particularly relevant in the rapidly evolving technology landscape.

Latest Patents

Ken-Hung Kuo holds a patent for a substrate for a semiconductor package. This invention includes a core layer and at least one metal layer applied over each of the upper and lower surfaces of the core layer. The metal layer on the upper surface forms a plurality of conductive traces, each having a terminal. The lower surface's metal layer is defined with a conductive region and a surrounding peripheral region, allowing for the formation of additional conductive traces. An insulating layer is applied over each of the metal layers, exposing terminals of the conductive traces and at least a corner portion of the peripheral region to the outside. This design facilitates the easy separation of vertically-stacked substrates during the fabrication of semiconductor packages.

Career Highlights

Ken-Hung Kuo is associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His role at the company has allowed him to contribute to advancements in semiconductor technology, particularly in the design and manufacturing processes.

Collaborations

Ken-Hung has collaborated with talented coworkers, including Yu-Ting Lai and Shy-Hwa Feng. Their combined efforts have led to innovative solutions in semiconductor packaging.

Conclusion

Ken-Hung Kuo's contributions to semiconductor packaging through his patent and work at Siliconware Precision Industries Co., Ltd. highlight his role as an influential inventor in the technology sector. His innovative designs continue to impact the industry positively.