This inventor holds 4 USPTO granted patents. Top assignee: Hitachi Chemical Company, Ltd.. Active years: 1981-1988.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Shimodate, JP (1981)
- Oyama, JP (1988)
Company Filing History:
Years Active: 1981-1988
Title: Keiji Hazama: Innovator in Semiconductor Packaging
Introduction
Keiji Hazama is a prominent inventor based in Oyama, Japan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work focuses on improving the reliability and efficiency of semiconductor packages, which are essential components in modern electronics.
Latest Patents
Hazama's latest patents include innovative processes and apparatuses for sealing semiconductor packages. One notable patent describes an apparatus and method for sealing semiconductor packages made from thermoplastic resin. In this design, a lead frame is positioned vertically at the center axis of the apparatus, with a pair of mold parts symmetrically aligned to create cavities for housing flat moldings. This method ensures that sealed semiconductor packages exhibit excellent sealing properties. Another significant patent details a semiconductor package structure that features a pair of flat moldings made from thermoplastic resin. This design includes a projection within the cavity that is welded to the rear side of a tab of the lead frame, enhancing heat dissipation and reliability while preventing deformation or cutting of wires connecting the semiconductor and lead frames.
Career Highlights
Keiji Hazama is associated with Hitachi Chemical Company, Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packaging, making them more efficient and reliable for various applications.
Collaborations
Hazama has collaborated with notable colleagues, including Toshiyuki Arai and Shin'ichi Ota. These partnerships have contributed to the development of cutting-edge technologies in the semiconductor industry.
Conclusion
Keiji Hazama's contributions to semiconductor packaging through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the reliability and efficiency of electronic components, making a lasting impact on technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile