The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 1988
Filed:
Jul. 24, 1986
Applicant:
Inventors:
Assignee:
Hitachi Chemical Co., Ltd., , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361421 ; 361388 ; 174 / ;
Abstract
A semiconductor package comprising a pair of flat moldings made from a thermoplastic resin, one of the flat moldings having in the cavity a projection which is welded to a rear side of a tab of lead frame mounting a semiconductor thereon by melt heating, is excellent in heat dissipation and reliability and provides no deformation nor cutting of wires connecting the semiconductor and lead frames.
Arai, Toshiyuki. (1988). Semiconductor package structure (U.S. Patent No. 4751611). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4751611
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile