The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 1988
Filed:
Jul. 30, 1986
Applicant:
Inventors:
Keiji Hazama, Oyama, JP;
Shin'ichi Ota, Shimodate, JP;
Mituo Yamada, Shimodate, JP;
Toshiyuki Arai, Tochigi, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ;
U.S. Cl.
CPC ...
156228 ; 1562722 ; 1562751 ; 156292 ; 1563084 ; 1563096 ; 1563099 ; 1563798 ; 156383 ; 156556 ; 156567 ; 156580 ; 264 25 ; 264248 ; 26427217 ; 4147 / ;
Abstract
An apparatus and method are described for sealing semiconductor packages made from a thermoplastic resin wherein a lead frame is positioned vertically at a center axis of the apparatus and a pair of mold parts having cavities for housing flat moldings are positioned symmetrically as to said center axis. With the described method and apparatus, sealed semiconductor packages with excellent sealing properties can be produced.
Quick Actions:
Hazama, Keiji. (1988). Process and apparatus for sealing semiconductor packages (U.S. Patent No. 4764235). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4764235
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile