Annaka, Japan

Keiichiro Asakawa


Average Co-Inventor Count = 3.0

ph-index = 5

Forward Citations = 70(Granted Patents)


Company Filing History:


Years Active: 1999-2002

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8 patents (USPTO):Explore Patents

Title: Keiichiro Asakawa: Innovator in Slurry Technology

Introduction

Keiichiro Asakawa is a notable inventor based in Annaka, Japan. He has made significant contributions to the field of slurry technology, holding a total of 8 patents. His work focuses on improving processes related to wire-saw slicing, which is essential in the semiconductor industry.

Latest Patents

Asakawa's latest patents include a slurry useful for wire-saw slicing and a wire cleaning apparatus. The slurry is designed with a viscosity adjusted to 400-700 mPa·second at a shear speed of 2/second and 50-300 mPa·second at a shear speed of 380/second. This viscosity is measured using a cone and plate type viscometer, allowing for efficient slicing of ingots into wafers or discs. The wire cleaning apparatus is a newly proposed device that removes slurry from a wire, utilizing a couple of multigrooved guide rollers and a slurry receiver. The centrifugal force generated during the wire's reciprocative movement helps shake off the slurry, which is then gathered in the receiver. The removal process is further enhanced by spraying a cleaning liquid simultaneously.

Career Highlights

Throughout his career, Keiichiro Asakawa has worked with various organizations, including the Super Silicon Crystal Research Institute Corporation. His innovative approaches have led to advancements in slurry technology, making significant impacts in the industry.

Collaborations

Asakawa has collaborated with notable individuals such as Hiroshi Oishi and Junichi Matsuzaki. Their combined expertise has contributed to the development of effective solutions in the field.

Conclusion

Keiichiro Asakawa's contributions to slurry technology and his innovative patents highlight his role as a key inventor in the industry. His work continues to influence advancements in wire-saw slicing processes.

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