The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2002
Filed:
Aug. 11, 2000
Applicant:
Inventors:
Hiroshi Oishi, Annaka, JP;
Keiichiro Asakawa, Annaka, JP;
Junichi Matsuzaki, Annaka, JP;
Akio Ashida, Tokyo, JP;
Assignee:
Other;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 1/114 ; G01N 1/902 ; B23D 2/502 ; B23D 1/04 ;
U.S. Cl.
CPC ...
G01N 1/114 ; G01N 1/902 ; B23D 2/502 ; B23D 1/04 ;
Abstract
Slurry useful for wire-saw slicing has viscosity adjusted to 400-700 mPa·second at a shear speed of 2/second and of 50-300 mPa·second at a shear speed of 380/second. The viscosity of slurry is measured using a cone and plate type viscometer which can measure viscosity at different shear speeds. Since the slurry sufficiently flows into inner parts of grooves formed in an ingot and consumed for wire-saw slicing due to the viscosity controlled in response to the shear speed, the ingot can be efficiently sliced to wafers or discs.