The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2000
Filed:
Mar. 16, 1998
Applicant:
Inventors:
Keiichiro Asakawa, Annaka, JP;
Hiroshi Oishi, Annaka, JP;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
B28D / ; B28D / ;
U.S. Cl.
CPC ...
125 1602 ; 125 21 ;
Abstract
An ingot slicing method and apparatus is disclosed. An ingot is sliced by a wire saw having a wire wound over a plurality of grooved rollers at a predetermined pitch. The ingot is secured to a holder and then pressed onto the wire which is carried along one direction or reciprocatively carried over a plurality of grooved rollers. The holder is shifted along one direction parallel to an axis of the grooved rollers until about a half section of the ingot is sliced. The holder is shifted along an inverse direction during slicing the remainder of the ingot. Thus, a wafer sliced off the ingot has a bowed shape corresponding to a locus of movement of the holder.