Tokyo, Japan

Keiichi Hiruma

This inventor holds 1 USPTO granted patent. Top assignee: Shinkawa Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Keiichi Hiruma. Retrieved from https://idiyas.com/inventor/keiichi-hiruma

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Keiichi Hiruma - Innovator in Mounting Technology

Introduction

Keiichi Hiruma is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of mounting technology, particularly through his innovative patent.

Latest Patents

Hiruma holds a patent for a mounting apparatus that enhances the efficiency of chip component installation on substrates. This device includes an application part that applies paste to form an application body, a bonding part that mounts the chip component, and two imaging parts that capture images before and after the mounting process. The control part of the apparatus evaluates the application and mounting processes based on the 3D shapes obtained from the images.

Career Highlights

Hiruma is currently employed at Shinkawa Ltd., where he continues to develop advanced technologies in the mounting sector. His work has been instrumental in improving the precision and reliability of electronic component assembly.

Collaborations

Hiruma collaborates with talented coworkers, including Tomonori Nakamura and Koji Matsushita, who contribute to the innovative environment at Shinkawa Ltd.

Conclusion

Keiichi Hiruma's contributions to mounting technology exemplify the impact of innovation in the electronics industry. His patent reflects a commitment to enhancing manufacturing processes and improving product quality.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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