The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Dec. 09, 2019
Shinkawa Ltd., Tokyo, JP;
Tomonori Nakamura, Tokyo, JP;
Koji Matsushita, Tokyo, JP;
Hiroshi Omata, Tokyo, JP;
Masahito Tsuji, Tokyo, JP;
Keiichi Hiruma, Tokyo, JP;
Mitsuteru Sakamoto, Tokyo, JP;
Ryo Urahashi, Tokyo, JP;
Takaya Kinjo, Tokyo, JP;
Shota Nakano, Tokyo, JP;
Akira Sekikawa, Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
A mounting device includes: an application part applying paste on a substrate to form an application body; a bonding part forming a mounted body by mounting a chip component on the substrate via the application body; a first imaging part imaging the application body after application processing and before mounting processing to acquire first image information; a second imaging part imaging the mounted body after the mounting processing to acquire second image information; and a control part controlling the application part, the bonding part, and the first and second imaging parts, and obtains a 3D application body shape (first shape) from the first image information as a first shape and calculates a 3D mounted body shape (second shape) from the second image information. The control part evaluates the application processing or the mounting processing based on the first and the second shapes.