Ke Leng

Title: Ke Leng - Innovator in Printed Circuit Board Technology

Introduction

Ke Leng is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of printed circuit board technology. His innovative approach has led to the development of a unique patent that enhances the functionality and efficiency of circuit boards.

Latest Patents

Ke Leng holds a patent for a "Diversified assembly printed circuit board and method for making the same." This invention features a first printed circuit board equipped with multiple first conductive metals protruding from its surface. Additionally, it includes several second printed circuit boards, each with multiple second conductive metals protruding from their surfaces. At the connection points, solidified conductive metal paste is used to electrically connect the first and second conductive metals. A laminated adhesive sheet is also utilized to physically connect the second printed circuit boards to the first printed circuit board. This innovative design improves the assembly and performance of printed circuit boards.

Career Highlights

Ke Leng is associated with Shennan Circuits Co., Ltd., a company known for its advancements in circuit board manufacturing. His work has contributed to the company's reputation for innovation and quality in the electronics industry. With 1 patent to his name, he continues to push the boundaries of technology in his field.

Collaborations

Ke Leng has collaborated with talented coworkers, including Hailong Liu and Jinfeng Liu. Their combined expertise fosters a creative environment that drives innovation within their projects.

Conclusion

Ke Leng's contributions to printed circuit board technology exemplify the spirit of innovation. His patent reflects a commitment to enhancing electronic assembly processes. As he continues to work with his team at Shennan Circuits Co., Ltd., the future of circuit board technology looks promising.