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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11324125 B1

PDFFull Text
Date of Patent:
May. 03, 2022

Filed:

Nov. 29, 2020

Diversified assembly printed circuit board and method for making the same

Applicant:

Shennan Circuits Co., Ltd., Shenzhen, CN;

Inventors:

Ke Leng, Shenzhen, CN;

Hailong Liu, Shenzhen, CN;

Jinfeng Liu, Shenzhen, CN;

Fengwu Wu, Shenzhen, CN;

Li Chen, Shenzhen, CN;

Lihua Zhang, Shenzhen, CN;

Assignee:

SHENNAN CIRCUITS CO., LTD., Shenzhen, CN;

Attorney:
Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/24 (2006.01); H05K 3/36 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/60 (2006.01); H01L 21/70 (2006.01); H01L 21/268 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/538 (2006.01); H05K 3/34 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 3/36 (2013.01); H05K 1/145 (2013.01); H05K 3/3485 (2020.08); H05K 2201/032 (2013.01);
Abstract

A diversified assembly printed circuit board includes a first printed circuit board provided with a multiple first conductive metals protruding from a surface of the first printed circuit board, and a multiple second printed circuit boards each provided with a multiple second conductive metals protruding from a surface of the each of the second printed circuit boards. At a connection position, solidified conductive metal paste is arranged between each of the first conductive metals and a corresponding second conductive metal to electrically connect each of the first conductive metals and the corresponding second conductive metal. A laminated adhesive sheet is arranged between each of the second printed circuit boards and the first printed circuit board to physically connect the second printed circuit boards and the first printed circuit board.

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