Fengwu Wu

Title: The Innovations of Fengwu Wu

Introduction

Fengwu Wu is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of printed circuit board technology. His innovative approach has led to the development of a unique patent that enhances the functionality and efficiency of circuit boards.

Latest Patents

Fengwu Wu holds a patent for a diversified assembly printed circuit board and the method for making the same. This invention includes a first printed circuit board equipped with multiple first conductive metals protruding from its surface. Additionally, it features multiple second printed circuit boards, each with multiple second conductive metals protruding from their surfaces. At the connection position, solidified conductive metal paste is arranged between each of the first conductive metals and the corresponding second conductive metal, ensuring electrical connectivity. A laminated adhesive sheet is also utilized to physically connect the second printed circuit boards to the first printed circuit board. This innovative design improves the assembly and functionality of printed circuit boards.

Career Highlights

Fengwu Wu is currently employed at Shennan Circuits Co., Ltd., where he continues to develop cutting-edge technologies in the field of electronics. His work has been instrumental in advancing the capabilities of printed circuit boards, making them more versatile and efficient.

Collaborations

Fengwu Wu collaborates with talented individuals such as Ke Leng and Hailong Liu. Their combined expertise contributes to the innovative projects at Shennan Circuits Co., Ltd.

Conclusion

Fengwu Wu's contributions to the field of printed circuit boards exemplify the spirit of innovation. His patented technology not only enhances the functionality of circuit boards but also showcases the potential for future advancements in electronics.