Ke Jung Jen

Title: Ke Jung Jen - Innovator in Semiconductor Technology

Introduction

Ke Jung Jen is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor device that enhances the detection of electrical continuity.

Latest Patents

Ke Jung Jen holds a patent for a semiconductor device and method of forming recesses in a conductive layer to detect continuity for interconnect between semiconductor die and substrate. This invention features a semiconductor die with composite bump structures over its surface. A conductive layer is formed over the substrate, which includes a channel at the interconnect site. The channel extends beyond the footprint of the composite bump structures. The semiconductor die is positioned over the substrate, and the bump material of the composite bump structures is melted. The structures are then pressed over the interconnect site, allowing the melted material to flow into the channel. Electrical continuity is detected by the presence of the bump material in the channel, while an absence indicates no continuity. This detection can be performed through visual inspection or X-ray.

Career Highlights

Ke Jung Jen is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices.

Collaborations

Some of his notable coworkers include Jen Yu Chen and Chien Chen Lee. Their collaborative efforts contribute to the innovative environment at Stats Chippac Pte. Ltd.

Conclusion

Ke Jung Jen's contributions to semiconductor technology exemplify the impact of innovation in the field. His patent reflects a significant advancement in detecting electrical continuity, showcasing his expertise and dedication to the industry.