Ayase, Japan

Kazutomo Hatano

This inventor holds 1 USPTO granted patent. Top assignee: Speedfam-Ipec Co Ltd. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kazutomo Hatano. Retrieved from https://idiyas.com/inventor/kazutomo-hatano

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Kazutomo Hatano: Innovator in Lapping and Polishing Technology

Introduction

Kazutomo Hatano is a notable inventor based in Ayase, Japan. He has made significant contributions to the field of processing machines, particularly in the area of lapping and polishing technology. His innovative approach has led to advancements that enhance the efficiency and precision of surface processing.

Latest Patents

Kazutomo Hatano holds a patent for a processing machine designed for lapping or polishing surfaces of silicon wafers and other workpieces. This machine features a platen that rotates with a constant supply of lapping or polishing compound. The platen is directly connected to a direct drive motor, allowing for precise control through a rotary encoder. This innovation streamlines the processing of delicate materials, ensuring high-quality finishes.

Career Highlights

Kazutomo Hatano is currently employed at Speedfam-Ipec Co Ltd, where he continues to develop cutting-edge technologies in the field of surface processing. His work has been instrumental in improving the performance and reliability of processing machines used in various industries.

Collaborations

Kazutomo collaborates with Mitsuru Maruya, a fellow innovator in the same field. Together, they work on projects that push the boundaries of technology and enhance the capabilities of processing machines.

Conclusion

Kazutomo Hatano's contributions to the field of lapping and polishing technology exemplify his dedication to innovation. His patent and ongoing work at Speedfam-Ipec Co Ltd highlight his role as a key figure in advancing processing machine technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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