The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2001
Filed:
Oct. 26, 1999
Applicant:
Inventors:
Kazutomo Hatano, Ayase, JP;
Mitsuru Maruya, Ayase, JP;
Assignee:
Speedfam-Ipec Co LTD, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 7/00 ;
U.S. Cl.
CPC ...
B24B 7/00 ;
Abstract
A lapping or polishing machine which processes the surface of silicon wafer or other work piece by rotating a platen with constant supply of lapping or polishing compound. Said platen of the lapping or polishing machine is connected directly to a direct drive motor and driven by the direct drive motor, and the point to point control of said platen is carried out by a rotary encoder.
Quick Actions:
Hatano, Kazutomo. (2001). Processing machine (U.S. Patent No. 6250997). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6250997
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile