This inventor holds 3 USPTO granted patents. Top assignees: Nippon Steel Chemical Co., Ltd., Dai Nippon Printing Co., Ltd.. Active years: 2006-2011.
Location History:
- Chiba, JP (2006 - 2008)
- Kisarazu, JP (2011)
Company Filing History:
Years Active: 2006-2011
Title: Kazuto Okamura: Innovator in Laminated Body Technology
Introduction
Kazuto Okamura is a notable inventor based in Chiba, Japan. He has made significant contributions to the field of laminated body technology, particularly in the development of insulating films and electronic circuit components. With a total of 3 patents to his name, Okamura's work has advanced the capabilities of flexible printed circuits and other electronic applications.
Latest Patents
Okamura's latest patents include innovations such as a wet etchable laminated body, an insulation film, and an electronic circuit part utilizing these advancements. The first patent presents a laminate that comprises an insulating layer with suppressed dusting properties, designed to enhance the performance of electronic circuit components. The second patent focuses on a laminate made from an insulating polyimide resin layer that is etchable by an aqueous alkaline solution, which is crucial for the manufacturing of flexible printed circuits. These inventions highlight Okamura's commitment to improving the efficiency and reliability of electronic materials.
Career Highlights
Throughout his career, Kazuto Okamura has worked with prominent companies such as Nippon Steel Chemical Co., Ltd. and Dai Nippon Printing Co., Ltd. His experience in these organizations has allowed him to refine his expertise in materials science and engineering, contributing to his innovative patent portfolio.
Collaborations
Okamura has collaborated with notable colleagues, including Makoto Shimose and Kazutoshi Taguchi. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in the field of laminated bodies.
Conclusion
Kazuto Okamura's contributions to laminated body technology and electronic materials have positioned him as a key figure in the industry. His innovative patents and collaborative efforts continue to influence advancements in electronic circuit design and manufacturing.