The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2008
Filed:
Feb. 25, 2002
Kazuto Okamura, Chiba, JP;
Kazutoshi Taguchi, Chiba, JP;
Kazunori Ohmizo, Chiba, JP;
Makoto Shimose, Chiba, JP;
Kazuto Okamura, Chiba, JP;
Kazutoshi Taguchi, Chiba, JP;
Kazunori Ohmizo, Chiba, JP;
Makoto Shimose, Chiba, JP;
Nippon Steel Chemical Co., Ltd., Tokyo, JP;
Abstract
This invention relates to a laminate comprising an insulating polyimide resin layer etchable by an aqueous alkaline solution and a metal foil. The laminate has an insulating resin layer composed of a plurality of polyimide resin layers on the metal foil and the insulating resin layer has at least one polyimide resin layer (A) with a coefficient of linear thermal expansion (CTE) of 30×10/° C. or less and at least one polyimide resin layer (B) with a glass transition temperature (Tg) of 300° C. or below, the layer in contact with the metal foil is the polyimide resin layer (B), the bonding strength between the metal foil and the polyimide resin layer (B) in contact therewith is 0.5 kN/m or more, and the average rate of etching of the insulating resin layer by a 50 wt % aqueous solution of potassium hydroxide at 80° C. is 0.5 μm/min or more. The laminate is useful for flexible printed circuits and the like.