The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Oct. 20, 2000
Takuhei Ohta, Chiba, JP;
Katsufumi Hiraishi, Chiba, JP;
Makoto Shimose, Chiba, JP;
Kazuto Okamura, Chiba, JP;
Naoya Okabayashi, Chiba, JP;
Kazunori Oomizo, Chiba, JP;
Takuhei Ohta, Chiba, JP;
Katsufumi Hiraishi, Chiba, JP;
Makoto Shimose, Chiba, JP;
Kazuto Okamura, Chiba, JP;
Naoya Okabayashi, Chiba, JP;
Kazunori Oomizo, Chiba, JP;
Nippon Steel Chemical Co., Ltd., Tokyo, JP;
Abstract
This invention relates to a laminate which changes in dimension to such a small extent as not to cause curling and warpage when the ambient humidity changes and is useful for flexible printed wiring boards. The laminate possesses a polyimide layer or layers of polyimides formed on a conductor by coating and at least one of the polyimide layers is composed of polyimide of low hygroscopic expansion obtained by the reaction of diamines containing 20 mol % or more of 4,4'-diamino-2,2′-dimethylbiphenyl with a tetracarboxylic acid compound and exhibiting a coefficient of linear hygroscopic expansion of 15×10/% RH or less.