This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Kaneka Corporation. Active years: 2001-2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Kobe, JP (2001)
- Settsu, JP (2017)
- Osaka, JP (2019)
Company Filing History:
Years Active: 2001-2019
Title: Kazuo Hagiwara: Innovator in Heat Dissipation Technology
Introduction
Kazuo Hagiwara is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of electronic components, particularly in heat dissipation technologies. With a total of 3 patents to his name, Hagiwara's work addresses critical challenges in managing heat in electronic devices.
Latest Patents
Hagiwara's latest patents include innovative solutions for heat dissipation structures. One of his inventions provides a heat dissipation structure that prevents contact failures in electronic components, making it suitable for high heat density applications. This invention also outlines a method for easily repairing electronic devices. The structure is created by filling and curing a thermally conductive resin composition within an electromagnetic shielding case on a substrate, which supports electronic components with heat densities ranging from 0.2 W/cm² to 500 W/cm². The thermally conductive resin composition consists of a curable liquid resin and a thermally conductive filler, ensuring effective heat management.
Another patent focuses on a heat dissipation structure that includes a printed circuit board and multiple heat-generating elements. This design ensures that the first heat-generating element, which produces equal or greater heat than the second, is effectively surrounded by a cured product that enhances thermal management.
Career Highlights
Kazuo Hagiwara is currently associated with Kaneka Corporation, where he continues to innovate in the field of electronic components. His work has been instrumental in developing technologies that improve the reliability and efficiency of electronic devices.
Collaborations
Hagiwara collaborates with talented coworkers, including Aki Koukami and Keisuke Oguma, who contribute to the advancement of their projects and innovations.
Conclusion
Kazuo Hagiwara's contributions to heat dissipation technology are significant and impactful. His patents reflect a deep understanding of the challenges faced in electronic component design and offer practical solutions for the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile