Kaneka Corporation

Kazuo Hagiwara

Keisuke Oguma

Aki Koukami

Toshihiko Okamoto

Junji Takase

Makoto Chiba

Masashi Sakaguchi

Kazuhide Fujimoto

The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cmto 500 W/cmis mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23&#xb0; C. of 30 Pa&#xb7;s to 3000 Pa&#xb7;s and a thermal conductivity of 0.5 W/(m&#xb7;K) or more, and being curable by moisture or heat.

Heat dissipation structure

A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

Heat dissipating structure

A curable resin composition containing (A) a saturated hydrocarbon polymer having at least one reactive silicon-containing group in a molecule, and (B) a hydrogenated oligomer of an &agr;-olefin, or a curable resin composition containing (A) a saturated hydrocarbon polymer having at least one reactive silicon-containing group in a molecule, (C) a saturated hydrocarbon oligomer, and (D) an ester plasticizer, both of which have good workability, in particular, at low temperature.

Curable resin composition

Growing community of inventors

Osaka, Japan

Kazuo Hagiwara