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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10356946 B1

PDFFull Text
Date of Patent:
Jul. 16, 2019

Filed:

Jun. 06, 2013

Heat dissipation structure

Applicant:

Kaneka Corporation, Osaka, JP;

Inventors:

Keisuke Oguma, Osaka, JP;

Aki Koukami, Osaka, JP;

Kazuo Hagiwara, Osaka, JP;

Assignee:

Kaneka Corporation, Osaka, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Sheeba Ahmed

Int. Cl.
CPC ...
C08L 71/02 (2006.01); C08L 33/00 (2006.01); H01L 23/42 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/552 (2006.01); B29C 73/02 (2006.01); H01L 23/29 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); B29C 73/02 (2013.01); C08L 33/00 (2013.01); C08L 71/02 (2013.01); H01L 23/295 (2013.01); H01L 23/3121 (2013.01); H01L 23/3737 (2013.01); H01L 23/552 (2013.01); H05K 7/20463 (2013.01); H05K 9/0024 (2013.01); H01L 23/42 (2013.01); H01L 25/0655 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/166 (2013.01); H01L 2924/16151 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/3025 (2013.01);
Abstract

The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cmto 500 W/cmis mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or more, and being curable by moisture or heat.

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