Keisuke Oguma

Title: Keisuke Oguma: Innovator in Low Dielectric Materials and Heat Dissipation Structures

Introduction

Keisuke Oguma is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of materials science, particularly in the development of low dielectric resin compositions and heat dissipation structures. With a total of 3 patents to his name, Oguma's work is recognized for its innovative approach to enhancing electronic components.

Latest Patents

Oguma's latest patents include a low dielectric resin composition, molded articles, films, multilayer films, and flexible printed wiring boards. The low dielectric resin composition he developed exhibits excellent melt processability and low dielectric characteristics in high-frequency applications. This composition includes a liquid crystal polymer and a graft-modified polyolefin with a polar group, achieving a dielectric constant of 2.80 or less at a frequency of 10 GHz. Additionally, he has patented a heat dissipation structure designed to prevent contact failures in electronic components, which is crucial for devices with high heat densities.

Career Highlights

Keisuke Oguma is currently employed at Kaneka Corporation, where he continues to push the boundaries of innovation in material science. His work has not only advanced the understanding of low dielectric materials but has also provided practical solutions for electronic devices that require efficient heat management.

Collaborations

Oguma has collaborated with notable colleagues such as Aki Koukami and Kazuo Hagiwara. Their combined expertise has contributed to the successful development of innovative technologies in their field.

Conclusion

Keisuke Oguma's contributions to the field of materials science, particularly in low dielectric materials and heat dissipation structures, highlight his role as a leading inventor. His patents reflect a commitment to advancing technology in electronic components, making a significant impact on the industry.