Saitama, Japan

Kazumi Itou


Average Co-Inventor Count = 3.0

ph-index = 3

Forward Citations = 28(Granted Patents)


Company Filing History:


Years Active: 1990-1991

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3 patents (USPTO):Explore Patents

Title: Kazumi Itou: Innovator in Cover Tape Technology

Introduction

Kazumi Itou, based in Saitama, Japan, is a noteworthy inventor with a commendable portfolio of three patents. Her contributions primarily focus on advancements in cover tape technology, addressing critical issues in the handling of electronic components.

Latest Patents

Kazumi Itou's latest patents include innovations designed for sealing chip-holding parts of carrier tapes. The first patent discusses a cover tape that consists of a base tape, an adhesive layer on one side, and a non-adhesive coat placed longitudinally along the base tape. This configuration ensures that while the chips held in the chip-holding parts are sealed, they do not come into contact with the adhesive layer, preventing any potential staining. The second patent outlines a similar methodology for creating this cover tape, emphasizing the importance of the non-adhesive coat, which allows for safe handling of chips without risking adhesive contamination.

Career Highlights

Kazumi Itou has significantly impacted the field of electronic component packaging through her innovative designs. Her experience includes notable positions at Lintec Corporation and FSK Kabushiki Kaisha, where she applied her inventive skills to enhance product functionality and safety. Her inventive solutions have proven essential for companies engaged in electronics manufacturing.

Collaborations

Throughout her career, Kazumi has collaborated with esteemed colleagues such as Toshio Minagawa and Kazuyoshi Ebe. These partnerships have fostered a dynamic exchange of ideas, contributing to the evolution of her inventive approaches in the industry.

Conclusion

Kazumi Itou stands out as an exceptional inventor in the realm of cover tape technology, with her patents reflecting a deep understanding of both functionality and user safety. Her work not only enhances the manufacturing process of electronic components but also sets a benchmark for future innovations in the field.

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