The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 1991

Filed:

Dec. 07, 1989
Applicant:
Inventors:

Kazumi Itou, Saitama, JP;

Kazuyoshi Ebe, Saitama, JP;

Toshio Minagawa, Saitama, JP;

Assignee:

Lintec Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427 541 ; 427 35 ; 427 36 ; 427 431 ; 427 44 ; 4272082 ; 4272086 ; 4272088 ; 427261 ; 4272855 ; 427286 ; 4273855 ;
Abstract

A cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided intermittently and longitudinally of said carrier tape, which cover is constituted by a base tape, an adhesive layer formed on one surface of said base tape and a non-adhesive coat formed on said adhesive along the longitudinal direction of said base tape so that said non-adhesive coat has a width greater than that of the chips and less than that of said adhesive layer. When the cover tape is used in combination with the carrier tape, the chip-holding parts are sealed by the cover tape having the non-adhesive coat and in consequence the chips held in the chip-holding parts do not come in contact with the adhesive layer although they might come in contact with the non-adhesive coat. Accordingly, the chips are not stained by the adhesive in the adhesive layer.


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