Saga, Japan

Kazuhiko Yasuhara

This inventor holds 2 USPTO granted patents. Top assignee: Tanaka Denshi Kogyo K.k.. Active years: 2016-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kazuhiko Yasuhara. Retrieved from https://idiyas.com/inventor/kazuhiko-yasuhara

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2016-2018

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2 patents (USPTO):Explore Patents

Title: **Innovations by Kazuhiko Yasuhara: A Pioneer in Bonding Wires for Semiconductor Devices**

Introduction

Kazuhiko Yasuhara, an inventive mind from Saga-ken, Japan, has contributed significantly to the field of semiconductor technologies. With a focus on enhancing the performance and reliability of semiconductor devices through innovative bonding wires, he has secured two patents that showcase his expertise and creativity.

Latest Patents

Yasuhara's latest inventions include a bonding wire specifically designed for high-speed signal lines and a novel silver-gold alloy bonding wire. The bonding wire for high-speed signal lines connects the pad electrode of a semiconductor device with the lead electrode on a circuit board. Its composition features palladium (Pd), platinum (Pt), silver (Ag), and a trace additive element, enabling improved signal integrity. The silver-gold alloy bonding wire, on the other hand, comprises an alloy with a gold content between 10% and 30% and calcium (Ca) ranging from 30 ppm to 90 ppm. This inventive wire also boasts a surface enriched with oxygen and calcium, along with a gold-enriched layer just beneath the surface, potentially increasing the reliability and efficiency of semiconductor connections.

Career Highlights

Kazuhiko Yasuhara is currently employed at Tanaka Denshi Kogyo K.K., a manufacturer that specializes in electronic components and innovative solutions. His position allows him to work at the forefront of technological advancements in the semiconductor industry. Throughout his career, Yasuhara has demonstrated a commitment to pushing the boundaries of existing technology and creating solutions that facilitate better performance in electronic devices.

Collaborations

In his journey as an inventor, Yasuhara collaborates with talented individuals such as Yuki Antoku and Jun Chiba. Together, they explore innovative ideas and methodologies that drive the development of cutting-edge technologies in bonding wires and semiconductor devices. Their teamwork emphasizes the importance of collaborative efforts in the field of innovation.

Conclusion

Kazuhiko Yasuhara stands out as a notable inventor within the semiconductor industry, particularly for his contributions to bonding wire technology. His two patents reflect his dedication to developing high-quality solutions that enhance the performance and reliability of electronic devices. As the industry continues to evolve, Yasuhara's innovations will undoubtedly play a critical role in shaping the future of semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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