The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Feb. 11, 2015
Tanaka Denshi Kogyo K.k., Chiyoda-ku, Tokyo, JP;
Kazuhiko Yasuhara, Saga-ken, JP;
Nanako Maeda, Saga-ken, JP;
Junichi Okazaki, Saga-ken, JP;
Jun Chiba, Saga-ken, JP;
Wei Chen, Saga-ken, JP;
Yuki Antoku, Saga-ken, JP;
TANAKA DENSHI KOGYO K.K., Tokyo, JP;
Abstract
The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with the remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage; a layer enriched with oxygen (O) and calcium (Ca) formed as a surface layer on the surface of the alloy; and a gold-enriched layer formed immediately below the surface layer.