The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Dec. 27, 2013
Applicant:
Tanaka Denshi Kogyo K.k., Chiyoda-ku, Tokyo, JP;
Inventors:
Yuki Antoku, Saga-ken, JP;
Kazuhiko Yasuhara, Saga-ken, JP;
Jun Chiba, Saga-ken, JP;
Wei Chen, Saga-ken, JP;
Junichi Okazaki, Saga-ken, JP;
Nanako Maeda, Saga-ken, JP;
Assignee:
TANAKA DENSHI KOGYO K.K., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/45 (2013.01); H01L 24/43 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/05669 (2013.01); H01L 2224/43 (2013.01); H01L 2224/43848 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45639 (2013.01); H01L 2224/48624 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48664 (2013.01); H01L 2224/48669 (2013.01); H01L 2924/00011 (2013.01); Y10T 428/2958 (2015.01);
Abstract
A bonding wire for a high-speed signal line for connecting a pad electrode of a semiconductor device and a lead electrode on a circuit board contains palladium (Pd), platinum (Pt), silver (Ag), and a trace additive element.