Saitama, Japan

Kazuhiko Sasada


Average Co-Inventor Count = 4.2

ph-index = 1

Forward Citations = 8(Granted Patents)


Location History:

  • Saitama, JP (2015 - 2016)
  • Tokyo, JP (2022)

Company Filing History:


Years Active: 2015-2022

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4 patents (USPTO):Explore Patents

Title: Kazuhiko Sasada: Innovator in Adhesive Technologies

Introduction

Kazuhiko Sasada is a prominent inventor based in Saitama, Japan. He has made significant contributions to the field of adhesive technologies, holding a total of 4 patents. His work focuses on developing advanced adhesive films and wiring members that enhance the performance and reliability of electronic components.

Latest Patents

Sasada's latest patents include innovative products such as an adhesive film and a flat wiring member utilizing this film. The adhesive film comprises a resin film with an adhesive layer that includes a specific resin composition. This composition features an epoxy resin with multiple epoxy groups and a unique amorphous resin that possesses carboxyl groups and a defined glass transition temperature. Additionally, he has developed an adhesive composition that combines a phenoxy resin, multifunctional isocyanate compounds, and maleimide compounds, along with inorganic fillers to enhance adhesive properties.

Career Highlights

Kazuhiko Sasada is currently employed at Hitachi Metals, Ltd., where he continues to innovate in the field of adhesive technologies. His work has been instrumental in advancing the capabilities of adhesive materials used in various applications, particularly in electronics.

Collaborations

Throughout his career, Sasada has collaborated with notable colleagues, including Hiroaki Komatsu and Daisuke Shanai. These collaborations have contributed to the development of cutting-edge adhesive solutions that meet the demands of modern technology.

Conclusion

Kazuhiko Sasada's contributions to adhesive technologies reflect his dedication to innovation and excellence. His patents and ongoing work at Hitachi Metals, Ltd. continue to shape the future of adhesive applications in electronics.

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