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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11230651 B1

PDFFull Text
Date of Patent:
Jan. 25, 2022

Filed:

Nov. 07, 2017

Adhesive film and a flat wiring member using the same

Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Daisuke Shanai, Tokyo, JP;

Akinari Nakayama, Tokyo, JP;

Kenichi Murakami, Tokyo, JP;

Kazuhiko Sasada, Tokyo, JP;

Masanobu Yamanobe, Tokyo, JP;

Assignee:

HITACHI METALS, LTD., Tokyo, JP;

Attorney:

McGinn IP Law Group, PLLC

Primary Examiner:

Samir Shah

Int. Cl.
CPC ...
C09J 167/00 (2006.01); B32B 15/20 (2006.01); B32B 15/08 (2006.01); B32B 27/06 (2006.01); C09J 7/25 (2018.01); B32B 15/18 (2006.01); C08K 3/013 (2018.01); B32B 27/28 (2006.01); C09J 175/06 (2006.01); B32B 3/10 (2006.01); C08K 5/5313 (2006.01); B32B 15/09 (2006.01); B32B 7/12 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); B32B 27/40 (2006.01); C09J 9/00 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01);
U.S. Cl.
CPC ...
C09J 167/00 (2013.01); B32B 3/10 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/09 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/06 (2013.01); B32B 27/281 (2013.01); B32B 27/286 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); B32B 27/40 (2013.01); C08K 3/013 (2018.01); C08K 5/5313 (2013.01); C09J 7/25 (2018.01); C09J 9/00 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 175/06 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2307/306 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/412 (2013.01); B32B 2307/422 (2013.01); B32B 2307/732 (2013.01); B32B 2405/00 (2013.01); B32B 2457/00 (2013.01); C08K 2201/006 (2013.01); C09J 2203/302 (2013.01); C09J 2203/326 (2013.01); C09J 2301/408 (2020.08); C09J 2463/00 (2013.01); C09J 2467/00 (2013.01); C09J 2475/00 (2013.01); C09J 2479/08 (2013.01); C09J 2479/086 (2013.01);
Abstract

An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer includes a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.

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