The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2016

Filed:

Jan. 17, 2014
Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Daisuke Shanai, Hitachi, JP;

Takashi Aoyama, Hitachi, JP;

Kazuhiko Sasada, Saitama, JP;

Hiroaki Komatsu, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 175/08 (2006.01); C09J 7/02 (2006.01); H05K 1/02 (2006.01); C08G 18/48 (2006.01); C08G 18/81 (2006.01); C08G 18/08 (2006.01); C09J 175/16 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); C08G 18/0852 (2013.01); C08G 18/4879 (2013.01); C08G 18/8116 (2013.01); C09J 7/0242 (2013.01); C09J 175/16 (2013.01); H05K 3/386 (2013.01); C09J 2203/326 (2013.01); C09J 2475/00 (2013.01); C09J 2479/086 (2013.01); H05K 2201/0154 (2013.01); Y10T 428/24959 (2015.01); Y10T 428/2852 (2015.01);
Abstract

An adhesive varnish includes 100 parts by mass of a component A that includes a phenoxy resin including a plurality of hydroxyl groups in a side chain, 2 to 55 parts by mass of a component B that includes a polyfunctional isocyanate compound including, in a molecule thereof, an isocyanate and at least one of a vinyl group, an acrylate group and a methacrylate group, 5 to 30 parts by mass of a component C that includes a maleimide compound including a plurality of maleimide groups in a molecule thereof or/and a reaction product thereof, a component Sincluding a low-boiling point solvent having a boiling point of not more than 100° C., and a component Sincluding a high-boiling point solvent having a boiling point of more than 100° C.


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