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For the Inventor, By the Inventor

Hadano, Japan

Kazuaki Karasawa

This inventor holds 18 USPTO granted patents and 2 published patent applications, plus 1 CIPO patent, primarily in Gas Sensors. Top assignee: Fujitsu Corporation. Active years: 1994-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kazuaki Karasawa. Retrieved from https://idiyas.com/inventor/kazuaki-karasawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 88.9


Average Co-Inventor Count = 3.5

ph-index = 6

Forward Citations = 243(Granted Patents)


Location History:

  • Kawasaki, JP (1994 - 2008)
  • Hadano, JP (2017 - 2023)

Company Filing History:

goldMedal18 out of 39,378 
 
Fujitsu Corporation
 patents

Years Active: 1994-2023

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Areas of Expertise:
Gas Sensor
Sensor Device
Manufacturing Method
Integrated Electronic Device
Semiconductor Device
Capacitor
Flip-Chip Connection
Data Center
Information Processing
Fabrication Method
Solder Bumps
Passive Component
18 patents (USPTO):Explore Patents
1. 11714057 - Method of manufacturing gas sensor device (2023-08-01),
2. 11073492 - Sensor device, method for producing same, and gas sensor (2021-07-27),
3. 10495595 - Gas sensor device, gas measurement method, and gas measurement device (2019-12-03),
4. 10481146 - Gas sensor and information processing system (2019-11-19),
5. 10371658 - Gas sensor and sensor apparatus (2019-08-06),
6. 9820412 - Modular data center (2017-11-14),
7. 7339277 - Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate (2008-03-04),
8. 6873038 - Capacitor and semiconductor device and method for fabricating the semiconductor device (2005-03-29),
9. 6764938 - Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof (2004-07-20),
10. 6624501 - Capacitor and semiconductor device (2003-09-23),
11. 6608381 - Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof (2003-08-19),
12. 6136047 - Solder bump transfer plate (2000-10-24),
13. 6121062 - Process of fabricating semiconductor unit employing bumps to bond two (2000-09-19),
14. 6008071 - Method of forming solder bumps onto an integrated circuit device (1999-12-28),
15. 5977637 - Integrated electronic device having flip-chip connection with circuit (1999-11-02),

Title: Spotlight on Inventor Kazuaki Karasawa

Introduction: Kazuaki Karasawa, a prolific inventor hailing from Hadano, Japan, has made significant contributions to the field of sensor technology. With an impressive portfolio of 18 patents to his name, Karasawa continues to push the boundaries of innovation in his work at Fujitsu Corporation.

Latest Patents:

1. Method of manufacturing gas sensor device: Karasawa's innovative method involves a gas sensor device comprising a polythiophene film with adsorbed cuprous bromide, enhancing the device's efficacy.

2. Sensor device, method for producing same, and gas sensor: This patent showcases a sensor device with a sensitive film containing Cu, a halogen element, and PEDOT/PSS for improved performance.

Career Highlights: Kazuaki Karasawa's career at Fujitsu Corporation has been marked by a series of groundbreaking patents in sensor technology. His dedication to advancing the field has solidified his reputation as a visionary inventor.

Collaborations: Karasawa has collaborated closely with esteemed coworkers such as Teru Nakanishi and Toshiya Akamatsu. Their combined expertise has led to the successful development of cutting-edge sensor devices that set new industry standards.

Conclusion: In conclusion, Kazuaki Karasawa's remarkable talent and relentless pursuit of innovation have positioned him as a prominent figure in the world of sensor technology. His patented inventions not only demonstrate his technical prowess but also showcase his commitment to pushing the boundaries of what is possible in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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