Katsurou Aoshima

Title: Katsurou Aoshima: Innovator in Copper-Clad Laminate Technology

Introduction

Katsurou Aoshima is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of materials science, particularly in the production of copper-clad laminates. His innovative approach has led to advancements that enhance the quality and performance of electronic components.

Latest Patents

Aoshima holds a patent for a process for producing copper-clad laminate. This process involves several key steps: first, contacting the surface of a conductive carrier with a catalyst liquid containing noble metals such as palladium, platinum, ruthenium, gold, and silver. Next, a copper foil layer is formed on the treated surface through copper electroplating. Following this, an insulating base is laminated onto the copper foil layer using hot-press bonding. Finally, the conductive carrier is separated from the resulting laminate. The copper foil layer produced through this method exhibits reduced pinholes and isotropic mechanical characteristics, making it highly effective for various applications.

Career Highlights

Throughout his career, Aoshima has worked with prominent companies, including Meiko Electronics Co., Ltd. and Toagosei Chemical Industry. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in the industry.

Collaborations

Aoshima has collaborated with notable colleagues such as Norio Kawachi and Tatsuo Wada. Their combined expertise has fostered innovation and development in the field of electronic materials.

Conclusion

Katsurou Aoshima's contributions to the production of copper-clad laminates have made a lasting impact on the electronics industry. His innovative processes and collaborations with esteemed colleagues highlight his role as a key figure in advancing material technology.