The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 1992
Filed:
Jun. 22, 1990
Norio Kawachi, Kanagawa, JP;
Katsurou Aoshima, Kanagawa, JP;
Tatsuo Wada, Kanagawa, JP;
Toshiro Miki, Tokyo, JP;
Takeharu Kato, Aichi, JP;
Meiko Electronics Co., Ltd., Kanagawa, JP;
Toagosei Chemical Industry, Tokyo, JP;
Abstract
A process for producing a copper-clad laminate is disclosed which includes the steps of (a) contacting the surface of a conductive carrier with a catalyst liquid containing at least one noble metal selected from the group consisting of Pd, Pt, Ru, Au, and Ag; (b) subsequently forming a copper foil layer on the treated surface of the conductive carrier by copper electroplating; (c) laminating an insulating base on the copper foil layer by hot-press bonding; and (d) separating the conductive carrier from the resulting laminate. The copper foil layer in the resulting copper-clad laminate has reduced pinholes and exhibits isotropic mechanical characteristics.