This inventor holds 4 USPTO granted patents. Top assignees: Mitsubishi Materials Corporation, Mitsubishi Metal Corporation. Active years: 1993-1997.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Omiya, JP (1993 - 1996)
- Kitamoto, JP (1997)
Company Filing History:
2 out of 1,556 
2 out of 68 
Years Active: 1993-1997
Title: Innovations by Katsumi Mogi
Introduction
Katsumi Mogi is a notable inventor based in Omiya, Japan. He has made significant contributions to the field of film thickness measurement and wafer polishing technology. With a total of 4 patents to his name, Mogi's work has had a considerable impact on the semiconductor industry.
Latest Patents
Mogi's latest patents include a film thickness measuring apparatus and method, as well as a light interference-type film thickness measuring mechanism. This mechanism measures film thickness by irradiating light onto the bottom surface of a wafer held by a wafer holding head. It receives the reflected light to provide accurate measurements. Additionally, he has developed a cleaning mechanism that includes a cleaning fluid tank, a wafer cleaning nozzle, and a light transmission portion cleaning nozzle. These components work together to ensure the cleanliness of the measuring points on the wafer's bottom surface. Another significant invention is a truing apparatus for wafer polishing pads, which achieves a sufficient truing effect while maximizing the polishing amount of the pad. This apparatus features a truing grinding wheel with ultra-abrasive grains and a support arm that allows for precise alignment and operation.
Career Highlights
Throughout his career, Katsumi Mogi has worked with prominent companies such as Mitsubishi Materials Corporation and Mitsubishi Metal Corporation. His experience in these organizations has allowed him to refine his skills and contribute to innovative technologies in the semiconductor sector.
Collaborations
Mogi has collaborated with notable colleagues, including Osamu Endo and Hiro Ohzeki. Their combined expertise has further advanced the development of technologies in their respective fields.
Conclusion
Katsumi Mogi's contributions to film thickness measurement and wafer polishing technology highlight his innovative spirit and dedication to advancing the semiconductor industry. His patents and collaborations reflect a commitment to excellence and progress in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile