The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 1996
Filed:
Mar. 20, 1995
Katsumi Mogi, Omiya, JP;
Osamu Endo, Omiya, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Abstract
A truing apparatus for a wafer polishing pad is provided which is capable of obtaining a sufficient truing effect while keeping the polishing amount of a polishing pad to a maximum. The truing apparatus includes a truing grinding wheel having an abrasive grain layer having ultra-abrasive grains electrodeposited thereon, a support arm for rotatably supporting the truing grinding wheel by bringing the polishing surface of an electrodeposition abrasive grain layer into abutment with the polishing pad, a grinding wheel rotary motor for rotating the grinding wheel, a self-aligning bearing disposed between a grinding wheel support plate and a grinding wheel rotation shaft, and pure water supply means for supplying pure water from the inside of the truing grinding wheel. The outer diameter of the grinding wheel is greater than the outer diameter of the wafers W, and the polishing surface of the grinding wheel is brought into abutment with the polishing pad over the overall width of one circumferential portion of a wafer polishing area. The grain size of the ultra-abrasive grains is preferably set at #60 to #230.