This inventor holds 1 USPTO granted patent and 6 published patent applications. Top assignee: Resonac Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations of Katsuhiko Tomisaka
Introduction
Katsuhiko Tomisaka is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor device production. His innovative work has led to the development of a unique adhesive sheet and its production method.
Latest Patents
Katsuhiko Tomisaka holds a patent for an "Adhesive sheet, production method for adhesive sheet, roll, and production method for connection structure." This patent outlines a production method for an adhesive sheet specifically designed for semiconductor device production. The method includes preparing a backing material-attached laminated body, a laminated body cutting step, and a backing material peeling step. This innovative approach enhances the efficiency and effectiveness of semiconductor manufacturing.
Career Highlights
Katsuhiko Tomisaka is currently employed at Resonac Corporation, where he continues to push the boundaries of innovation in his field. His work has garnered attention for its practical applications in technology and manufacturing.
Collaborations
Some of his coworkers include Kenta Kikuchi and Hiroyuki Izawa, who contribute to the collaborative environment at Resonac Corporation.
Conclusion
Katsuhiko Tomisaka's contributions to the field of semiconductor device production through his innovative adhesive sheet patent exemplify the importance of creativity in technology. His work continues to influence advancements in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile