The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Aug. 09, 2022
Resonac Corporation, Tokyo, JP;
Kenta Kikuchi, Tokyo, JP;
Hiroyuki Izawa, Tokyo, JP;
Takashi Tatsuzawa, Tokyo, JP;
Mayumi Sato, Tokyo, JP;
Yasuo Maehara, Tokyo, JP;
Hiroshi Takaira, Tokyo, JP;
Takahiro Fukui, Tokyo, JP;
Katsuhiko Tomisaka, Tokyo, JP;
Toshiaki Matsuzaki, Tokyo, JP;
Resonac Corporation, Tokyo, JP;
Abstract
A production method for an adhesive sheet for semiconductor device production including: preparing a backing material-attached laminated body including a laminated body and a backing material; a laminated body cutting step of making an incision in the laminated body along any cut-out shape; and a backing material peeling step of peeling the backing material from the laminated body, wherein in the backing material peeling step, a portion of the laminated body existing in a region surrounded by the incision is attached to the backing material and removed.