Company Filing History:

27 out of 29,297

Texas Instruments Corporation

where one patent can have more than one assignee

Years Active: 1993-2004

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27 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6730541 - Wafer-scale assembly of chip-size packages (2004-05-04),

2. 6528873 - Ball grid assembly with solder columns (2003-03-04),

3. 6432744 - Wafer-scale assembly of chip-size packages (2002-08-13),

4. 6251767 - Ball grid assembly with solder columns (2001-06-26),

5. 6234296 - System for positioning a carrier relative to a travel path (2001-05-22),

6. 6227353 - System for applying a rotary force to strips of varying widths (2001-05-08),

7. 6226452 - Radiant chamber for simultaneous rapid die attach and lead frame embed for ceramic packaging (2001-05-01),

8. 6096578 - Stress relief matrix for integrated circuit packaging (2000-08-01),

9. 6069342 - Automated multiple lead frame strip radiant die attach material curing (2000-05-30),

10. 6030859 - Method of making a packaged semiconductor device and a lead-frame (2000-02-29),

11. 5994169 - Lead frame for integrated circuits and process of packaging (1999-11-30),

12. 5993591 - Coring of leadframes in carriers via radiant heat source (1999-11-30),

13. 5894173 - Stress relief matrix for integrated circuit packaging (1999-04-13),

14. 5840599 - Process of packaging an integrated circuit with a conductive material (1998-11-24),

15. 5650915 - Thermally enhanced molded cavity package having a parallel lid (1997-07-22),

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