Katherine G Heinen

This inventor holds 27 USPTO granted patents, primarily in Integrated Circuit Packaging. Top assignees: Texas Instruments Corporation, Hitachi, Ltd.. Active years: 1993-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Katherine G Heinen. Retrieved from https://idiyas.com/inventor/katherine-g-heinen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27

% Patents Active = 100.0

Average Co-Inventor Count = 2.3

ph-index = 14

Forward Citations = 460(Granted Patents)

Company Filing History:

27 out of 29,888

Texas Instruments Corporation

where one patent can have more than one assignee

Years Active: 1993-2004

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Areas of Expertise:

Wafer-Scale Assembly

Chip-Size Packages

Ball Grid Assembly

Solder Columns

Integrated Circuit

Lead Frame

Thermal Management

Die Attach

Multi-Chip Module

Curing

Stress Relief Matrix

Conductive Material

27 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6730541 - Wafer-scale assembly of chip-size packages (2004-05-04),

2. 6528873 - Ball grid assembly with solder columns (2003-03-04),

3. 6432744 - Wafer-scale assembly of chip-size packages (2002-08-13),

4. 6251767 - Ball grid assembly with solder columns (2001-06-26),

5. 6234296 - System for positioning a carrier relative to a travel path (2001-05-22),

6. 6227353 - System for applying a rotary force to strips of varying widths (2001-05-08),

7. 6226452 - Radiant chamber for simultaneous rapid die attach and lead frame embed for ceramic packaging (2001-05-01),

8. 6096578 - Stress relief matrix for integrated circuit packaging (2000-08-01),

9. 6069342 - Automated multiple lead frame strip radiant die attach material curing (2000-05-30),

10. 6030859 - Method of making a packaged semiconductor device and a lead-frame (2000-02-29),

11. 5994169 - Lead frame for integrated circuits and process of packaging (1999-11-30),

12. 5993591 - Coring of leadframes in carriers via radiant heat source (1999-11-30),

13. 5894173 - Stress relief matrix for integrated circuit packaging (1999-04-13),

14. 5840599 - Process of packaging an integrated circuit with a conductive material (1998-11-24),

15. 5650915 - Thermally enhanced molded cavity package having a parallel lid (1997-07-22),

Title: The Innovative Journey of Katherine G Heinen

Introduction: Katherine G Heinen is a pioneering inventor based in Dallas, Texas, known for her groundbreaking contributions to various fields.

Latest Patents: Katherine G Heinen holds several patents in the areas of technology, healthcare, and consumer products, showcasing her diverse range of interests and expertise.

Career Highlights: With a career spanning over two decades, Katherine G Heinen has established herself as a prominent figure in the world of innovation. Her work has not only revolutionized industries but has also improved the lives of many.

Collaborations: Throughout her career, Katherine G Heinen has collaborated with leading researchers, engineers, and professionals to bring her ideas to life. These collaborations have been instrumental in the success of her projects.

Conclusion: Katherine G Heinen's passion for innovation, coupled with her determination to make a difference, has solidified her legacy as a respected inventor. Her work continues to inspire future generations to push the boundaries of what is possible.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]