The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2000

Filed:

Dec. 16, 1997
Applicant:
Inventors:

Gonzalo Amador, Dallas, TX (US);

Katherine Gail Heinen, Dallas, TX (US);

Jessie Buendia, Richardson, TX (US);

Leslie E Stark, Dallas, TX (US);

Chill Go, Baguio, PH;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B65G / ; B65G / ; H01L / ; F27B / ;
U.S. Cl.
CPC ...
219388 ; 1562755 ; 414187 ; 414214 ; 41433113 ; 1983461 ;
Abstract

A method of curing a die attach material for a semiconductor device which includes providing a carrier containing a plurality of stacked leadframe strips, each leadframe strip with a die attach material thereon. One leadframe strip is ejected from the carrier, travels into a chamber and is centered therein. The leadframe strip is then heated and the die attach material is cured selective to the leadframe strip using a tungsten-halogen lamp. Simultaneously volatile products of the cure are exhausted from the chamber. The leadframe strip is then returned to its original position in the carrier, the carrier is elevated so that a different leadframe strip is in position for ejection from the carrier and is ejected.


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