The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 1999
Filed:
Dec. 16, 1997
Jesus S Buendia, Richardson, TX (US);
Katherine Gail Heinen, Dallas, TX (US);
Gonzalo Amador, Dallas, TX (US);
Leslie E Stark, Dallas, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method and system for curing a die attach material for attachment of a semiconductor die to a leadframe which includes a carrier receiving location for receiving at least one carrier(1) wherein each carrier contains at least one leadframe strip (3) therein, a die attach material (15) on the leadframe strip and a semiconductor die (13) on the die attach material. A heat source (5) is provided for radiating thermal energy to the carrier receiving location. A reflector (9) is disposed around the heat source and the carrier receiving location for reflecting thermal energy from the heat source to the carrier receiving location. A source of flowing cool gas (11) is provided in heat exchange relationship with the reflector for cooling the reflector while heating the gas. The heated gas is passed through the carrier receiving location to provide a source of heat by convection at the carrier receiving location and purge the carrier receiving location of volatiles. The heat source provides radiations principally in the range of from about 0.5.mu. to about 2.0.mu. and is preferably a tungsten halogen lamp. The heat source is controllable responsive to a function of the instantaneous temperature of the die attach material and the leadframe strip to control the intensity and profile of the heat source. Cooling air is optionally injected into the system upon completion of curing.