Kartik Srinivasan

Title: Kartik Srinivasan: Innovator in Thermal Compression Technology

Introduction

Kartik Srinivasan is a notable inventor based in Gilbert, Arizona, recognized for his contributions to thermal compression technology. With two patents to his name, he has made significant advancements in the field, particularly in the design of bonding nozzles.

Latest Patents

Srinivasan's latest patents include a thermal compression bonder nozzle with vacuum relief features. This innovative apparatus comprises a bonding nozzle that features one or more channels in its bonding surface. The channels consist of a first channel portion located in the inner region of the bonding surface and a second channel portion along the outer periphery. These channels are in fluid communication with a vacuum port, enhancing the efficiency of the bonding process. Additionally, a vacuum relief conduit within the bonding nozzle includes a first opening into the second channel portion and a second opening along the exterior wall of the nozzle.

Career Highlights

Kartik Srinivasan is currently employed at Intel Corporation, where he continues to develop cutting-edge technologies. His work focuses on improving manufacturing processes through innovative designs and engineering solutions.

Collaborations

Srinivasan collaborates with talented colleagues, including Mihir A Oka and Wei Tan, who contribute to his projects and enhance the overall innovation environment at Intel Corporation.

Conclusion

Kartik Srinivasan's work in thermal compression technology exemplifies the spirit of innovation. His patents and contributions to Intel Corporation highlight his role as a key inventor in the field.