The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

May. 27, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Mihir Oka, Chandler, AZ (US);

Kartik Srinivasan, Gilbert, AZ (US);

Wei Tan, Chandler, AZ (US);

James Mellody, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/00 (2006.01); H01L 23/00 (2006.01); B23K 3/00 (2006.01); B23K 37/04 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 3/00 (2013.01); B23K 37/04 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75303 (2013.01); H01L 2224/75984 (2013.01);
Abstract

An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.


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