This inventor holds 1 USPTO granted patent. Top assignee: Winbond Electronics Corporation. Active years: 2005.
Company Filing History:
Years Active: 2005
Title: Innovations by Inventor Kai-Ye Huang
Introduction
Kai-Ye Huang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of integrated circuit technology. His work focuses on improving measurement techniques for interconnect coupling capacitance in IC chips.
Latest Patents
Kai-Ye Huang holds a patent for a method and test structures for measuring interconnect coupling capacitance in an IC chip. This innovative method employs the CBCM technique. In the first step, two test structures are utilized to measure a target configuration to obtain the total capacitance C of a metal line with respect to ground, including line-to-line, fringe, and area components. The formula used is C=2C+2C+C. In the second step, two other test structures measure a dummy configuration to obtain the area and fringe capacitance C of the metal line with respect to ground, using the formula C=2C+C. After completing these two steps, the coupling capacitance C between the metal line and another line can be determined using the formula C=(C−C)/2.
Career Highlights
Kai-Ye Huang is currently employed at Winbond Electronics Corporation, where he continues to advance his research and development efforts in semiconductor technology. His work has been instrumental in enhancing the performance and reliability of integrated circuits.
Collaborations
Kai-Ye Huang collaborates with Chuan-Jane Chao, contributing to various projects within the field of integrated circuit design and measurement techniques.
Conclusion
Kai-Ye Huang's innovative approach to measuring interconnect coupling capacitance has made a significant impact in the semiconductor industry. His contributions continue to shape the future of integrated circuit technology.