The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2005
Filed:
Nov. 04, 2003
Kai-ye Huang, Taipei, TW;
Chuan-jane Chao, Hsinchu, TW;
Kai-Ye Huang, Taipei, TW;
Chuan-Jane Chao, Hsinchu, TW;
Abstract
Measurement method and test structures for measuring interconnect coupling capacitance in an IC chip are provided. This method employs CBCM technique. In the first step, two test structures are used to measure a target configuration in order to obtain the total capacitance C of a metal line with respect to ground including line-to-line, fringe and area components (C=2C+2C+C). In the second step, two other test structures are used to measure a dummy configuration in order to obtain the area and fringe capacitance Cof the metal line with respect to ground including fringe and area components (C=2C+C). After the two steps, the coupling capacitance Cbetween the metal line and another line can be determined according to the formula C=(C−C)/2.