Company Filing History:
Years Active: 2004
Title: Innovator Spotlight: Kai-Ming Chin and His Patented Bumping Process
Introduction: Kai-Ming Chin is a distinguished inventor based in Taiping, Taiwan, known for his innovative contributions to semiconductor technology. With a keen focus on improving manufacturing processes, Chin has made strides in the field, culminating in a noteworthy patent.
Latest Patents: One of Kai-Ming Chin's most significant inventions is the "Fluxless Bumping Process Using Ions". This patent details a sophisticated method that involves providing a semiconductor device with a bond pad and an under bump metallurgy. The process also includes forming a solder structure over the under bump metallurgy, where the solder has an outer layer of tin oxide. Further, the patent describes producing a plasma from gases such as CF, SF, and H, exposing the solder structure to this plasma, heating it, and cooling it to create a solder bump on the semiconductor device. This innovative methodology enhances the efficiency and reliability of semiconductor manufacturing.
Career Highlights: Kai-Ming Chin serves at Taiwan Semiconductor Manufacturing Company Limited, a leading institution in the semiconductor industry. His role there has allowed him to explore cutting-edge technologies and contribute to advancements in manufacturing processes that affect the entire sector.
Collaborations: Throughout his career, Chin has worked alongside esteemed colleagues such as Hsin-Hui Lee and Chia-Fu Lin. Their collaborative efforts have fostered an environment of innovation and have propelled developments in their respective projects, aiding in the progression of semiconductor technology.
Conclusion: Kai-Ming Chin’s inventive spirit and dedication to refining semiconductor processes through his patented fluxless bumping technology serve as a testament to the vital role inventors play in shaping the future of technology. His contributions not only mark significant advancements within his company but also lay the groundwork for future innovations in the semiconductor industry.