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Taoyuan, Taiwan

Kai-Jun Zhan

USPTO Granted Patents = 9

Average Co-Inventor Count = 6.2

ph-index = 1

Forward Citations = 8(Granted Patents)

Company Filing History:

9 out of 40,635

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2019-2025

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9 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 12463166 - Chip structure and method for forming the same (2025-11-04),

2. 12412858 - Semiconductor device structure with conductive bumps (2025-09-09),

3. 12015002 - Chip structure and method for forming the same (2024-06-18),

4. 11990440 - Structure and formation method of semiconductor device with conductive bumps (2024-05-21),

5. 11942445 - Semiconductor device with conductive pad (2024-03-26),

6. 11152319 - Micro-connection structure and manufacturing method thereof (2021-10-19),

7. 11101233 - Semiconductor device and method for forming the same (2021-08-24),

8. 10651142 - Micro-connection structure and manufacturing method thereof (2020-05-12),

9. 10283471 - Micro-connection structure and manufacturing method thereof (2019-05-07),

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