This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: The Innovations of Kai-Cheng Chen
Introduction
Kai-Cheng Chen is an inventor based in Taoyuan City, Taiwan. He has made significant contributions to the field of semiconductor packaging. His innovative ideas focus on enhancing the efficiency and reliability of multi-die packages.
Latest Patent Applications
One of his notable patent applications is titled "HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF FORMING THE SAME." This application describes a semiconductor package that includes a package substrate, a first semiconductor die, and a second semiconductor die, both electrically and mechanically coupled to the package substrate. The design incorporates a non-conductive film formed between the first semiconductor die and the package substrate, along with a capillary underfill material positioned between the second semiconductor die and the package substrate. The innovative structure aims to improve the performance and durability of semiconductor packages.
Conclusion
Kai-Cheng Chen's work in semiconductor packaging showcases his commitment to innovation in the field. His latest patent application reflects his dedication to advancing technology and improving product reliability.